(July 14, 2016, 12:54 PM EDT) -- ALEXANDRIA, Va. — Claims 13 and 15 of a patented method for forming integrated circuit “interconnects” that link components in a microchip are unpatentable because the claims “recite well-known processes for making well-known structures,” according to a July 12 petition for inter partes review filed with the Patent Trial and Appeal Board (Taiwan Semiconductor Manufacturing Company Ltd. v. Godo Kaisha IP Bridge 1, No. IPR2016-01376, PTAB)....