Inter Partes Review Sought In Dispute Over Microchip Links
(July 14, 2016, 12:54 PM EDT) -- ALEXANDRIA, Va. — Claims 13 and 15 of a patented method for forming integrated circuit “interconnects” that link components in a microchip are unpatentable because the claims “recite well-known processes for making well-known structures,” according to a July 12 petition for inter partes review filed with the Patent Trial and Appeal Board (Taiwan Semiconductor Manufacturing Company Ltd. v. Godo Kaisha IP Bridge 1, No. IPR2016-01376, PTAB).
(Petition available. Document #16-160718-020C.)
Petitioner Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) notes in its filing that the owner of U.S....